Elimination of hillocks on Al‐Si metallization by fast‐heat‐pulse alloying
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.95219
Reference8 articles.
1. Thermal Cycling and Surface Reconstruction in Aluminum Thin Films
2. Hillock‐free integrated‐circuit metallizations by Al/Al‐O layering
3. Hillock Growth on Vacuum Deposited Aluminum Films
4. A method for eliminating hillocks in integrated-circuit metallizations
5. Contact Resistance of Al/Si Ohmic Electrodes Formed by Rapid Lamp Sintering.
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