Characterization of room temperature recrystallization kinetics in electroplated copper thin films with concurrent x-ray diffraction and electrical resistivity measurements
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4807899
Reference36 articles.
1. Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature
2. Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing
3. The kinetics and mechanism of room-temperature microstructural evolution in electroplated copper foils
4. Studies of the driving force for room-temperature microstructure evolution in electroplated copper films
5. Copper Metallization for High Performance Silicon Technology
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1. Microstructure of combined electroless and galvanic deposits on roll annealed copper foils and copper single crystals;Thin Solid Films;2020-11
2. The search for the most conductive metal for narrow interconnect lines;Journal of Applied Physics;2020-02-07
3. Prediction of recrystallization times in electroplated copper thin films;Thin Solid Films;2016-09
4. Rapid trench initiated recrystallization and stagnation in narrow Cu interconnect lines;Applied Physics Letters;2015-10-26
5. A method for the monitoring of metal recrystallization based on thein-situmeasurement of the elastic energy release using neutron diffraction;Review of Scientific Instruments;2015-05
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