Electrodeposition of Cu(111) onto a Ru(0001) seed layer for epitaxial Cu interconnects-Reference-Cited by-同舟云学术

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Electrodeposition of Cu(111) onto a Ru(0001) seed layer for epitaxial Cu interconnects

Published:2021-10-07 Issue:13 Volume:130 Page:135301
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Gusley Ryan R.¹^ORCID,Cumston Quintin²^ORCID,Coffey Kevin R.²^ORCID,West Alan C.¹^ORCID,Barmak Katayun³^ORCID

Affiliation:

1. Department of Chemical Engineering, Columbia University, New York, New York 10027, USA

2. Department of Materials Science and Engineering, University of Central Florida, Orlando, Florida 32816, USA

3. Department of Applied Physics and Applied Mathematics, Columbia University, New York, New York 10027, USA

Funder

Semiconductor Research Corporation

National Science Foundation

Air Force Office of Scientific Research

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

https://aip.scitation.org/doi/am-pdf/10.1063/5.0063418

Reference65 articles.

1. Electron mean free path in elemental metals

2. Epitaxial metals for interconnects beyond Cu

3. The search for the most conductive metal for narrow interconnect lines

4. On twin density and resistivity of nanometric Cu thin films

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Magnetic field-assisted electrochemical additive manufacturing of nickel structure: Growth mechanism and microstructural evolution;Materials Today Communications;2024-08

2. Review–On Epitaxial Electrodeposition of Co, Cu, and Ru for Interconnect Applications;Journal of The Electrochemical Society;2022-08-01

3. Erratum: “Electrodeposition of Cu(111) onto a Ru(0001) seed layer for epitaxial Cu interconnects” J. Appl. Phys. 130, 135301 (2021);Journal of Applied Physics;2022-05-28

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