Thin film interactions of Al and Al(Cu) on TiW
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.335765
Reference10 articles.
1. Metallization for very-large-scale integrated circuits
2. Application of Ti: W barrier metallization for integrated circuits
3. Thermal stability of diffusion barriers for aluminum alloy/platinum silicide contacts
4. The use of titanium-based contact barrier layers in silicon technology
5. Studies of the Ti-W/Au metallization on aluminum
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