Characterization and removal of silicon surface residue resulting from CHF3/C2F6reactive ion etching
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.357294
Reference6 articles.
1. The role of chemisorption in plasma etching
2. An Overview of Dry Etching Damage and Contamination Effects
3. Contamination of Silicon Surfaces Exposed to CHF 3 Plasmas: An XPS Study of the Film and the Film‐Surface Interface
4. Near‐surface damage and contamination of silicon following electron cyclotron resonance etching
5. A Study of CCl2F2Magnetron Ion Etching Damage and Contamination Effects in Silicon
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