Interdiffusion and resistivity of Cu/Au, Cu/Co, Co/Au, and Cu/Co/Au thin films at 25–550 °C
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.346567
Reference11 articles.
1. Ambient dependence of the interactions in Pt/Ni/Cu and Au/Ni/Cu structures
2. Interaction in Cu/Al and Pt/Cu/Al thin films: Competing oxygen effects and preferential reaction between Pt and CuAl alloy
3. Electrical resistance and Auger electron spectroscopy characteristics of interdiffusion in Au/metal bilayer films
4. Effects of C+implantation on the interdiffusion and resistivity of Cu/Ni/Au thin films
5. Thin-film interactions and their relevance to electronic packaging
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