Thermal and photochemical promotion of silicon and silicon dioxide etching by carbonyl difluoride
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.337120
Reference26 articles.
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3. Plasma Etch Rates of Porous Silica Low-kFilms with Different Dielectric Constants;Japanese Journal of Applied Physics;2006-11-08
4. Excimer laser cleaning and processing of Si(100) substrates in ultrahigh vacuum and reactive gases;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1992-07
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