Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2870014
Reference18 articles.
1. Ductility of Nanostructured Materials
2. High tensile ductility in a nanostructured metal
3. Simultaneously Increasing the Ductility and Strength of Ultra-Fine-Grained Pure Copper
4. Tailoring stacking fault energy for high ductility and high strength in ultrafine grained Cu and its alloy
5. Simultaneously Increasing the Ductility and Strength of Nanostructured Alloys
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