Imaging of current paths and defects in Al and TiSi interconnects on very-large-scale integrated-circuit chips using near-field optical-probe stimulation and resulting resistance change-Reference-Cited by-同舟云学术

Imaging of current paths and defects in Al and TiSi interconnects on very-large-scale integrated-circuit chips using near-field optical-probe stimulation and resulting resistance change

Published:1999-02-15 Issue:7 Volume:74 Page:1048-1050
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Nikawa K.,Saiki T.,Inoue S.,Ohtsu M.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.123451

Reference6 articles.

1. Insituscanning electron microscopy observation of the dynamic behavior of electromigration voids in passivated aluminum lines

2. Novel Method for Defect Detection in Al Stripes by Means of Laser Beam Heating and Detection of Changes in Electrical Resistance

3. Imaging spatial variations in resistance along electrical conductors

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