Nondestructive fault localization of IC interconnection by using ultrasonic heating
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/56/i=7S1/a=07JC11/pdf
Reference33 articles.
1. New Laser Beam Neating Methods Applicable to Fault Localization and Defect Detection in VLSI Devices
2. Novel Method for Defect Detection in Al Stripes by Means of Laser Beam Heating and Detection of Changes in Electrical Resistance
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Sensitivity improvement of ultrasonic beam induced resistance change (SOBIRCH) method with ultrasound resonance inside mold resin;Microelectronics Reliability;2020-06
2. Frequency determination in nondestructive test of semiconductor devices with ultrasound heating;Japanese Journal of Applied Physics;2020-05-13
3. Method of estimating contact force of bone-conducted sound transducer with a two-degrees-of-freedom vibrating model;Japanese Journal of Applied Physics;2019-06-28
4. Ultrasonic beam induced resistance change (SOBIRCH) method for failure analysis of semiconductor devices encapsulated by mold resin;Japanese Journal of Applied Physics;2019-06-10
5. Verification of contact force estimation method for the bone-conducted sound transducer with human subjects;Japanese Journal of Applied Physics;2018-06-19
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