Direct observation of electromigration-induced surface atomic steps in Cu lines by in situ transmission electron microscopy
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2740109
Reference21 articles.
1. Evidence of grain-boundary versus interface diffusion in electromigration experiments in copper damascene interconnects
2. Effect of liner thickness on electromigration lifetime
3. Electromigration path in Cu thin-film lines
4. An introduction to Cu electromigration
5. Copper metallization reliability
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