Infrared‐absorption spectroscopy of Si(100) and Si(111) surfaces after chemomechanical polishing
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.360721
Reference45 articles.
1. Bonding of silicon wafers for silicon‐on‐insulator
2. Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit Interconnections
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