High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3309750
Reference27 articles.
1. Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints
2. Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
3. The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints
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