Filling high aspect ratio trenches by superconformal chemical vapor deposition: Predictive modeling and experiment
Author:
Affiliation:
1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, 1304 W. Green St, Urbana, Illinois 61801, USA
Funder
Division of Materials Research (DMR)
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4902158
Reference21 articles.
1. High aspect ratio contacts: A review of the current tungsten plug process
2. Shallow trench isolation for advanced ULSI CMOS technologies
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