Design of a novel 5-DOF flexure-based compound alignment stage for Roll-to-Roll Printed Electronics-Reference-Cited by-同舟云学术

Design of a novel 5-DOF flexure-based compound alignment stage for Roll-to-Roll Printed Electronics

Published:2017-02 Issue:2 Volume:88 Page:025002
ISSN:0034-6748
Container-title:Review of Scientific Instruments
language:en
Short-container-title:Review of Scientific Instruments

Author:

Chen Weihai¹,Yang Shang¹^ORCID,Liu Jingmeng¹,Chen Wenjie²,Jin Yan³

Affiliation:

1. School of Automation Science and Electrical Engineering, Beihang University, Beijing 100191, China

2. Mechatronics Group, Singapore Institute of Manufacturing Technology, Singapore

3. School of Mechanical and Aerospace Engineering, Queens University Belfast, Belfast, United Kingdom

Funder

National Natural Science Foundation of China (NSFC)

Publisher

AIP Publishing

Subject

Instrumentation

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4974814

Reference32 articles.

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4. V. Kantola, J. Kulovesi, L. Lahti, R. Lin, M. Zavodchikova, and E. Coatanea,1.3 Printed Electronics, Now and Future(Bit Bang, 2009), pp. 63-102.

5. P. Angelo. “Inkjet-Printed Light-Emitting Devices: Applying Inkjet Microfabrication to Multilayer Electronics,” Ph.D. dissertation (University of Toronto, 2013).

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