Ionized physical vapor deposition of integrated circuit interconnects
Author:
Publisher
AIP Publishing
Subject
Condensed Matter Physics
Link
http://aip.scitation.org/doi/pdf/10.1063/1.872829
Reference38 articles.
1. Simulations of metal thin film thermal flow processes
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4. Integrated plasma-promoted chemical vapor deposition route to aluminum interconnect and plug technologies for emerging computer chip metallization
5. Angular distribution of particles sputtered from Cu, Pt and Ge targets by keV Ar+ ion bombardment
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