Stress distribution in released vacuum‐deposited aluminum films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.339935
Reference23 articles.
1. Grain Growth and Stress Relief in Thin Films
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5. Stresses in thin films: The relevance of grain boundaries and impurities
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1. Characterization of silver selenide thin films grown on Cr-covered Si substrates;Surface and Interface Analysis;2008-12-19
2. Resistivity and adhesive strength of thin film metallizations on single crystal quartz;IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control;1997-03
3. Compositional dependence of stress in silver copper alloys prepared by direct current magnetron sputtering;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1992-11
4. Modeling structural and chemical relaxation at the Al/Si epitaxial interface;Journal of Electronic Materials;1991-07
5. Thin film stress from nonspherical substrate bending measurements;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1991-07
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