Full-field optical measurement of curvatures in ultra-thin-film–substrate systems in the range of geometrically nonlinear deformations
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1364650
Reference22 articles.
1. Principles and Applications of Wafer Curvature Techniques for Stress Measurements in Thin Films
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