Detection of small-size solder ball defects through heat conduction analysis-Reference-Cited by-同舟云学术

Detection of small-size solder ball defects through heat conduction analysis

Published:2018-02 Issue:2 Volume:89 Page:024905
ISSN:0034-6748
Container-title:Review of Scientific Instruments
language:en
Short-container-title:Review of Scientific Instruments

Author:

Zhou Xiuyun¹,Chen Yaqiu¹,Lu Xiaochuan¹

Affiliation:

1. School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu, China

Funder

National Natural Science Foundation of China

Publisher

AIP Publishing

Subject

Instrumentation

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5003674

Reference19 articles.

1. Defect characterisation using pulsed eddy current thermography under transmission mode and NDT applications

2. Investigation on high temperature mechanical fatigue failure behavior of SnAgCu/Cu solder joint

3. X. N. Lu, “Research on defects inspection of flip chip using active infrared thermography technology,” Master’s thesis (Huazhong University of Science and Technology, 2012).

4. X-ray digital microlaminography for BGA and flip-chip inspection

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