Simulation of redeposition during platinum etching in argon plasmas
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3343346
Reference34 articles.
1. Microtrenching resulting from specular reflection during chlorine etching of silicon
2. Analytical modeling of silicon etch process in high density plasma
3. Monte Carlo simulation method for etching of deep trenches in Si by a SF6/O2 plasma mixture
4. Platinum etching in Ar/Cl2 plasmas with a photoresist mask
5. Effect of Potential Field on Ion Deflection and Shape Evolution of Trenches during Plasma‐Assisted Etching
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