Guest Editorial: Dimensional Scaling of Material Functional Properties to Meet Back-End-of-Line (BEOL) Challenges-Reference-Cited by-同舟云学术

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Guest Editorial: Dimensional Scaling of Material Functional Properties to Meet Back-End-of-Line (BEOL) Challenges

Published:2023-07-17 Issue:3 Volume:123 Page:
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:

Author:

Rakheja Shaloo¹^ORCID,Chen Zhihong²^ORCID,Chen Ching-Tzu³^ORCID

Affiliation:

1. Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign 1 , Urbana, Illinois 61801, USA

2. Birck Nanotechnology Center, Purdue University 2 , West Lafayette, Indiana 47907, USA

3. IBM Thomas J. Watson Research Center 3 , Yorktown Heights, New York 10598, USA

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

https://pubs.aip.org/aip/apl/article-pdf/doi/10.1063/5.0165095/18047001/030401_1_5.0165095.pdf

Reference58 articles.

1. Advanced nanomaterials for energy conversion and storage: Current status and future opportunities;Nanoscale,2021

2. Recent developments in 2D layered inorganic nanomaterials for sensing;Nanoscale,2015

3. Emerging optical in-memory computing sensor synapses based on low-dimensional nanomaterials for neuromorphic networks;Adv. Intelligent Syst.,2022

4. Two-dimensional materials for next-generation computing technologies;Nat. Nanotechnol.,2020

5. Electronics based on two-dimensional materials;Nat. Nanotechnol.,2014

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Critical Review of Nanoindentation-Based Numerical Methods for Evaluating Elastoplastic Material Properties;Coatings;2023-07-29

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