Monitoring ion etching of GaAs/AlGaAs heterostructures by real time spectroscopic ellipsometry: Determination of layer thicknesses, compositions, and surface temperature
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.106873
Reference18 articles.
1. Dielectric functions and optical parameters of Si, Ge, GaP, GaAs, GaSb, InP, InAs, and InSb from 1.5 to 6.0 eV
2. Interband critical points of GaAs and their temperature dependence
3. Optical properties of AlxGa1−xAs
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1. Reflectance anisotropy spectroscopy (RAS) for in-situ identification of roughness morphologies evolving during reactive ion etching (RIE);Applied Surface Science;2023-02
2. Interferometric in-situ III/V semiconductor dry-etch depth-control with ±0.8 nm best accuracy using a quadruple-Vernier-scale measurement;Journal of Vacuum Science & Technology B;2021-09
3. Atomic layer sensitive in-situ plasma etch depth control with reflectance anisotropy spectroscopy (RAS);Optical Measurement Systems for Industrial Inspection X;2017-06-26
4. Precise in situ etch depth control of multilayered III−V semiconductor samples with reflectance anisotropy spectroscopy (RAS) equipment;Beilstein Journal of Nanotechnology;2016-11-21
5. Influence of plasma composition on reflectance anisotropy spectra for in situ III–V semiconductor dry-etch monitoring;Applied Surface Science;2015-12
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