Kinetics of Al grain growth, Al2Cu precipitation, and dissolution in blanket thin films and fine lines
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.357543
Reference24 articles.
1. The Effect of Annealing on the Cu Distribution and AI2Cu Precipitation in Ai(Cu) Thin Films
2. The role of Cu distribution and Al2Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines
3. Mechanical properties and microstructural characterization of Al-0.5%Cu thin films
4. Texture Development in Thin Metallic Films
5. Microstructure of sputter‐deposited Al–Cu–Si films
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