Modeling electromigration-induced stress evolution and drift kinetics with a stress-dependent diffusivity
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1287760
Reference15 articles.
1. Erratum: Electromigration in thin aluminum films on titanium nitride
2. Erratum: Electromigration in thin aluminum films on titanium nitride
3. Stress generation by electromigration
4. The threshold current density and incubation time to electromigration in gold films
5. Stress evolution due to electromigration in confined metal lines
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2. Simulation of electromigration effects on voids in monocrystalline Ag films;Physical Review B;2012-01-30
3. Direct Measurement of Electromigration-Induced Stress in Interconnect Structures;IEEE Transactions on Device and Materials Reliability;2007-06
4. Theoretical Analysis of Vacancy Transport Combined with Electromigration and Stress Induced Voiding;2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual;2007-04
5. Direct Measurement of Electromigration Induced Stress in Interconnect Structures;2006 IEEE International Reliability Physics Symposium Proceedings;2006
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