Enhancement of light reflectance and thermal stability in Ag–Cu alloy contacts on p-type GaN
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2956417
Reference12 articles.
1. Fabrication and efficiency improvement of micropillar InGaN∕Cu light-emitting diodes with vertical electrodes
2. High-power GaN-mirror-Cu light-emitting diodes for vertical current injection using laser liftoff and electroplating techniques
3. Highly reflective low resistance Ag-based Ohmic contacts on p-type GaN using Mg overlayer
4. Formation process of high reflective Ni∕Ag∕Au Ohmic contact for GaN flip-chip light-emitting diodes
5. Ohmic and degradation mechanisms of Ag contacts on p-type GaN
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