Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics-Reference-Cited by-同舟云学术

Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics

Published:2017-10-16 Issue:16 Volume:111 Page:161906
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Vanstreels K.,Krishtab M.^ORCID,Garcia Gonzalez L.,Armini S.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4993088

Reference25 articles.

1. Low dielectric constant materials for microelectronics

2. E. P. Guyer and R. H. Dauskardt , in IEEE 2003 International Interconnect Technology Conference, 2–4 June 2003 (Burlingame, CA, USA, 2003), pp. 89–91.

3. E. P. Guyer and R. H. Dauskardt , in IEEE 2004 International Interconnect Technology Conference, 7–9 June 2004 (Burlingame, CA, USA, 2004), pp. 236–238.

4. Effect of solution pH on the accelerated cracking of nanoporous thin-film glasses

5. Fracture of nanoporous methyl silsesquioxane thin-film glasses

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