Diffusional creep as a stress relaxation mechanism in electromigration
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.366729
Reference37 articles.
1. Electromigration in metals
2. Electromigration and IC Interconnects
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4. Electromigration in thin aluminum films on titanium nitride
5. The threshold current density and incubation time to electromigration in gold films
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