Decomposition and product formation in CF4‐O2plasma etching silicon in the afterglow
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.329812
Reference17 articles.
1. Plasma etching of Si and SiO2—The effect of oxygen additions to CF4 plasmas
2. The plasma oxidation of CF4in a tubular‐alumina fast‐flow reactor
3. Molecular beam analysis investigation of the reaction between atomic fluorine and carbon tetrachloride
4. The electron impact spectra of the fluoromethanes
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