Elimination of hillock formation in Al interconnects using Ni or Co
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.370776
Reference17 articles.
1. Semiconductor interlevel shorts caused by hillock formation in Al-Cu metallization
2. A transmission electron microscopy study of hillocks in thin aluminum films
3. Hillock growth on aluminum and aluminum alloy films
4. Influence of adding transition metal elements to an aluminum target on electrical resistivity and hillock resistance in sputter‐deposited aluminum alloy thin films
5. A study of hillock formation on AlTa alloy films for interconnections of TFT-LCDs
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