Structural characterization of porous low-kthin films prepared by different techniques using x-ray porosimetry
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1641955
Reference15 articles.
1. Low Dielectric Constant Materials for ULSI Interconnects
2. Structural Comparison of Hydrogen Silsesquioxane Based Porous Low-k Thin Films Prepared with Varying Process Conditions
3. Ultralow-k dielectrics prepared by plasma-enhanced chemical vapor deposition
4. Characteristics of low-k and ultralow-k PECVD deposited SiCOH films.
5. Determination of pore-size distribution in low-dielectric thin films
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