Reflow of copper in oxygen anneal ambients
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1288783
Reference14 articles.
1. Theory of Thermal Grooving
2. The Effect of Grain Boundaries on Surface Diffusion Mediated-Planarization of Polycrystalline Cu Films
3. Tarnish Studies
4. Capillary instabilities in thin films. I. Energetics
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