Effect of the physical and mechanical properties of epoxy resins on the adhesion behavior of epoxy/copper leadframe joints-Reference-Cited by-同舟云学术

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Effect of the physical and mechanical properties of epoxy resins on the adhesion behavior of epoxy/copper leadframe joints

Published:2001-01 Issue:4 Volume:15 Page:439-456
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Cho Kilwon,Cho Eun Chul,Park Chan Eon

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference19 articles.

1. The Strength of an Adhesive Weak Boundary Layer

2. Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading. II. Using alloy 42 as leadframe material

3. Residual stresses in plastic IC packages during surface mounting process preceded by moisture soaking test

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of Epoxy Molding Compound on SOP Device;2022 China Semiconductor Technology International Conference (CSTIC);2022-06-20

2. Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms;Materials;2019-02-12

3. Enhancement of Epoxy Resin/Copper Heterojunction by Introduction of Sulfur-Containing Polymers;Macromolecular Materials and Engineering;2006-03-14

4. General Adhesion Measurement References;Adhesion Measurement Methods;2005-11-21

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