Author:
Hirano Hiroshi,Okada Takuto,Nakamura Yoshinobu,Kadota Joji,Watase Seiji,Hasegawa Kiichi
Subject
Materials Chemistry,Polymers and Plastics,Organic Chemistry,General Chemical Engineering
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4. Adhesion improvement of epoxy resin/copper lead frame j oints by azole compounds
5. Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints
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