Investigation of the locus and mechanism of adhesion failure during peel tests on copper-chromium coated polyimide systems
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883
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1. Metallized Plastics 1
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5. Aluminum/polyimide interface formation: An x‐ray photoelectron spectroscopy study of selective chemical bonding
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1. Electroless Copper Plating onto Polyimide Using Polymer Nanosheet as a Nano-Adhesive;Polymer Journal;2006-11-24
2. Site-Selective Direct Silver Metallization on Surface-Modified Polyimide Layers;Langmuir;2003-10-28
3. Plasma Treatment of Polymers;Journal of Dispersion Science and Technology;2003-01-07
4. Adhesion to Sodium Naphthalenide Treated Fluoropolymers. Part III. Mechanism of Adhesion;The Journal of Adhesion;1992-12
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