Electroless Copper Plating onto Polyimide Using Polymer Nanosheet as a Nano-Adhesive
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Polymers and Plastics
Reference41 articles.
1. Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching
2. Investigation of the locus and mechanism of adhesion failure during peel tests on copper-chromium coated polyimide systems
3. Measurement and improvement of the adhesion of copper to polyimide
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