An Auger study on the interaction of Cu and Cr films with polyimide
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883
Reference24 articles.
1. Chemical bonding at the polyimide surface
2. Synchrotron‐radiation excited carbon 1s photoemission study of Cr/organic polymer interfaces
3. Adhesion of evaporated titanium films to ion‐bombarded polyethylene
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1. Thickness effect on the fracture and delamination of titanium films;Thin Solid Films;2015-08
2. The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model;Acta Materialia;2015-05
3. Adhesion measurement of a buried Cr interlayer on polyimide;Philosophical Magazine;2014-05-23
4. Wetting characteristics of Cu–xZn layers for Sn–3.0Ag–0.5Cu solders;Journal of Alloys and Compounds;2013-08
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