Author:
Lee Ji Hyun,Kim Young Min,Hwang Ji Hwan,Kim Young-Ho
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference30 articles.
1. H.R. Roh, C.Y. Oh, Y.-H. Kim, W.K. Choi, Y.C. Sohn, C.Y. Moon, in: Proceedings of International Conference on Electronics packaging, Tokyo, Japan, 2007, pp. 1–5.
2. A new solder wetting layer for Pb-free solders
3. H.R. Roh, Y.-H. Kim, in: Proceedings of International Conference on Electronic Materials and Packaging, Daejeon, Korea, 2007, pp. 1–4.
4. Wettability and interfacial reactions of Sn-based Pb-free solders with Cu–xZn alloy under bump metallurgies
5. Interfacial Reaction of Sn and Cu-xZn Substrates After Reflow and Thermal Aging
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献