Fatigue lifetime assessment of adhesive joints by ultrasonic and thermal wave imaging
Author:
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883
Reference22 articles.
1. Metal Joining with Adhesives
2. Adhesion and Adhesives
3. Effect of bonding defects on shear strength in tension of lap joints having brittle adhesives
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Chip Warpage Damage Model for ACA Film Type Electronic Packages;Key Engineering Materials;2005-11
2. Design guidelines for composite patches bonded to cracked aluminum substrates;Journal of Adhesion Science and Technology;2002-01
3. Parametric dependence of fatigue of electronic adhesives;IEEE Transactions on Components and Packaging Technologies;1999-06
4. Evaluation of fatigue strength of adhesively bonded single and single step double lap joints based on stress singularity parameters;Engineering Fracture Mechanics;1999-03
5. Acousto-Ultrasonic Techniques for Evaluation of Bond Integrity of Composite Repair Patches;Review of Progress in Quantitative Nondestructive Evaluation;1998
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