Bonding and wear characteristics of a tri-n-butylborane initiated adhesive resin filled with pre-polymerized composite particles
Author:
Publisher
Nihon University School of Dentistry
Subject
General Dentistry
Reference17 articles.
1. The promotion of adhesion by the infiltration of monomers into tooth substrates
2. 2. Omura I, Yamauchi J, Nagase Y, Uemura F (1983) Methacryloyloxyalkyl dihydrogen phosphate. Japan Patent Application S58-21687.
3. Study on triazine thiols. V. Polymerization of 6-(4-vinylbenzyl propyl) amino-1,3,5-triazine-2,4-dithiol on copper plates and their corrosion resistance
4. Bonding fixed prosthodontic composite resin and precious metal alloys with the use of a vinyl-thiol primer and an adhesive opaque resin
5. 5. Kimura M, Aizawa M (1998) Thiouracil derivative. Japan Patent Application H10-1473.
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. High-purity butoxydibutylborane catalysts enable the low-exothermic polymerization of PMMA bone cement with enhanced biocompatibility and osseointegration;Journal of Materials Chemistry B;2024
2. Long‐term marginal adaptation and nanoleakage of class V cavity restored with organic filler filled 4‐META/MMA‐TBB resin;Journal of Biomedical Materials Research Part B: Applied Biomaterials;2018-12-21
3. Comparison of access-hole filling materials for screw retained implant prostheses: 12-month in vivo study;International Journal of Implant Dentistry;2017-05-05
4. Management of developmental enamel defects in the primary dentition;Journal of Oral Science;2017
5. Wear characteristics of trimethylolpropane trimethacrylate filler-containing resins for the full crown restoration of primary molars;Dental Materials Journal;2016
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3