Effect of Bonding Conditions on Al/Cu Dissimilar Bonding with Liquefaction by Reaction Diffusion in Air
Author:
Publisher
Japan Welding Society
Subject
Metals and Alloys,Surfaces, Coatings and Films,Mechanical Engineering,Mechanics of Materials
Reference17 articles.
1. 1) Toshio Enjo, Kenji Ikeuchi and Naofumi Akikawa: Effect of Oxide Film on the Early Process of Diffusion Welding, Journal of the JWS, 51-3(1982), 272-279.(in Japanese)
2. 2) Osamu Ohashi, Kinji Tanuma and Kazuhiro Yoshihara: Auger Microanalysis of Surface Film on Diffusion Welding Interface, Quarterly Journal of the JWS, 3-1(1985), 152-158.(in Japanese)
3. 3) Kenji Ikeuchi, Keiko Kotani and Fukuhisa Matsuda: Behavior of Oxide at Diffusion-Bonded Interface of Al-Mg-Si Series 6063 Alloy, Quarterly Journal of the JWS, 14-1(1996), 122-128.(in Japanese)
4. 4) Isao Itoh, Yasuo Otoguro and Hiroaki Samata: Diffusion welding of Al-Sn alloy in the Atmosphere, Journal of Japan Institute of Light Metals, 42-7(1992), 383-388.(in Japanese)
5. 5) A. S. Zuruzi, H. Li and G. Dong: Effect of Surface Roughness on the Diffusion Bonding of Al Alloy 6061 in air, Material Science and Engineering, A270(1999), 244-248.
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