Effect of Heating Rate on Al Bonding in Air by Inserted A5056 Disk

Author:

Kawakami Hiroshi1,Kimura Keiko1,Kondo Satoshi1,Suzuki Jippei1

Affiliation:

1. Mie University

Abstract

Al bonding in air by inserted A5056 was investigated in this study. Heating rate in thermal history of bonding process may have the relation with the growth of Al oxide film and the deformation of bonding surface by softening. Both of phenomena affect the joinability and the mechanical properties of bond. Al bonding in air was carried out by several heating rate. Growth of Al oxide film significantly suppressed the progress of bonding in air by low heating rate, 1K/s. Decrease of deformation of bonding surface suppressed also the progress of bonding by high heating rate, 10K/s. In case of medium heating rate, 5K/s, good joinabilty of Al bonding in air was obtained by the medium growth of oxide film and the deformation of bonding surface.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference8 articles.

1. A.S. Zuruzi, H. Li, G. Dong: Effect of surface roughness on the diffusion bonding of Al Alloy 6061 in air, Material Science and Engineering, A270(1999), 244-248.

2. C.S. Lee, H. Li, R.S. Chandel: Vacuum-free Diffusion Bonding of Aluminum Metal Matrix Composite, Journal of Material Processing Technology, 89-90(1999), 326-330.

3. D.S. Duvall, W.A. Owczarski, D.F. Paulonis: TLP bonding: a New Method for Joining Heat Resistant Alloys, Welding Journal, Vol. 53, No. 4(1974), 203-214.

4. Toshio Enjo, Kenji Ikeuchi: Diffusion Welding of Al-Cu-Mg Series 2017 Alloy, Quarterly Journal of the JWS, Vol. 2, No. 4(1984), 599-605. (in Japanese).

5. Osamu Ohashi, Ken Sasabe: Effect of Alloying Element on Behavior of Oxide Film at Diffusion-welded Interface of Aluminum Alloys, Quarterly Journal of the JWS, Vol. 7, No. 4(1989), 449-455. (in Japanese).

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