Comparative Study of Sn-based Solder Wettability on Aluminum Substrate
Author:
Affiliation:
1. Graduate School of Engineering， Osaka University
2. Joining and Welding Research Institute Osaka University
Publisher
Japan Welding Society
Subject
Metals and Alloys,Surfaces, Coatings and Films,Mechanical Engineering,Mechanics of Materials
Link
https://www.jstage.jst.go.jp/article/qjjws/41/2/41_26a/_pdf
Reference26 articles.
1. 1) L. Ceschini, I. Borromei, A. Minak, F. Morri, Tarterini CompositesPart A: Applied Science and Manufacturing, 38 (2007), pp. 1200-1210.
2. 2) Fan, X. J., B. Varia, and Q. Han. “Design and optimization of thermo-mechanical reliability in wafer level packaging.” Microelectronics Reliability 50.4 (2010): 536-546.
3. 3) Yao, Yao, et al. “Interfacial structure and growth kinetics of intermetallic compounds between Sn-3.5 Ag solder and Al substrate during solder process.” Journal of Alloys and Compounds 682 (2016): 627-633.
4. 4) Mirski, Zbigniew, Ireneusz Ciepacz, and Tomasz Wojdat. “Soldering of 7075 Aluminum Alloy Using Ni-P and Cu-Cr Electrodeposited Interlayers.” Materials 13.18 (2020): 4100.
5. 5) Hashemabad, Somayeh Gheybi, Zhiyong Gu, and Teiichi Ando. “Flux-less direct soldering of aluminum by ultrasonic surface activation.”Journal of Materials Processing Technology 233 (2016):135-141.
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