Funder
National Natural Science Foundation of China
Science Fund for Creative Research Groups of NSFC
Science Challenge Project
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference123 articles.
1. S Gao. Fundamental research on silicon wafer thinning by ultra-precision grinding. Dalian University of Technology, 2013. (in Chinese)
2. Y X Zhang. Study on the surface layer damage of monocyrstalline silicon wafer induced by ultra-precision grinding. Dalian University of Technology, 2006. (in Chinese)
3. Z J Pei. A study on surface grinding of 300 mm silicon wafers. International Journal of Machine Tools and Manufacture, 2002, 42(3): 385–393.
4. R K Kang, Y X Zhang, D M Guo, et al. Study on the Surface and Subsurface Integrity of Ground Monocrystalline Silicon Wafers. Key Engineering Materials, 2005, 291–292: 425–432.
5. J M Zhang, J G Sun, Z J Pei. Application of Laser scattering on detection of subsurface damage in silicon wafers. ASME 2003 International Mechanical Engineering Congress and Exposition, Washington, DC, USA, November 15–21, 2003: 15–24.
Cited by
57 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献