Revealing Subsurface Damage Morphology and Patterns in areal Ultrashort Pulse Laser Machining of Glass

Author:

Frank Samson,Reichenbächer Maria,Seiler Michael,Thelemann Dennis,Arnold Thomas,Bliedtner Jens

Abstract

AbstractMaterial removal rates as well as surface and subsurface quality are key aspects for the industrial application of ultrashort pulse (USP) laser machining. However, revealing so-called subsurface damage (SSD) is challenging. The presented study visualizes and quantifies subsurface damage patterns in areal USP laser ablation of fused silica (FS) and glass N-BK7 (BK). For the first time, using high-resolution optical coherence tomography (OCT) as non-destructive and three-dimensional (3D) evaluation method, SSD morphologies of areal laser machining induced damages are analysed. Influences of laser wavelength, beam geometry and processed material are investigated. Discovered differences of damage morphologies and depth in FS and BK point out the relevance of selecting suitable process parameters. Based on the evaluation of volumetric OCT data, the authors were able to quantify damage morphologies using the surface texture ratio as well as power spectral density functions. One important finding for the quantification and comparability of damage depths in USP laser processing is the influence of applicable evaluation thresholds. In comparison to area thresholds of 0.001% being applicable to OCT measurements, more lenient thresholds of e.g. 1% commonly applied in destructive SSD measurement methods in average result in a reduction of measured damage depths by a factor of ~ 2. This potentially leads to an underestimation of damage depths depending on methods on thresholds used. The presented measurement and evaluation methods as well as gained process insights are important assets for the future optimization of low-damage USP laser micromachining of brittle materials. Moreover, the general applicability and relevance of OCT-based morphological damage analysis in laser material processing is shown.

Funder

Ernst-Abbe-Hochschule Jena

Publisher

Springer Science and Business Media LLC

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