Author:
Shih Jian-Yu,Chen Yen-Chi,Chiu Chih-Hung,Lo Chung-Lun,Chang Chi-Chung,Chen Kuan-Neng
Abstract
Abstract
This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such as Cu TSVs, sealing bonding, and wafer thinning. It is different from conventional quartz resonator using ceramic-based package. With evaluation of mechanical structure design and package performances, this quartz resonator with advanced silicon-based package shows great manufacturability and excellent performance to replace traditional metal lid with ceramic-based interposer fabrication approach.
Publisher
Springer Science and Business Media LLC
Subject
Condensed Matter Physics,General Materials Science
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