Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers-Reference-Cited by-同舟云学术

Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

Published:2014-11-29 Issue:1 Volume:9 Page:
ISSN:1556-276X
Container-title:Nanoscale Research Letters
language:en
Short-container-title:Nanoscale Res Lett

Author:

Wang Zifeng,Fu Yuqiao,Meng Wenjun,Zhi Chunyi

Abstract

Abstract A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, which is 1,600% improvement in comparison with that of pristine epoxy material. In addition, the as-fabricated samples exhibit excellent overall performances with great mechanical property and thermal stability well preserved.

Publisher

Springer Science and Business Media LLC

Subject

Condensed Matter Physics,General Materials Science

Link

https://link.springer.com/content/pdf/10.1186/1556-276X-9-643.pdf

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