Failure Behavior of Nickel Silicide Diffusion Barrier between Electroplating Cu and Textured Si Substrate
-
Published:2020-06
Issue:
Volume:
Page:5277-5286
-
ISSN:1452-3981
-
Container-title:International Journal of Electrochemical Science
-
language:
-
Short-container-title:Int. J. Electrochem. Sci.