Laser dicing of silicon and electronics substrates-Reference-Cited by-同舟云学术

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Laser dicing of silicon and electronics substrates

Published:2010 Issue: Volume: Page:88-135
ISSN:
Container-title:Advances in Laser Materials Processing
language:
Short-container-title:

Author:

Heng H.Y.Z.,Wang X.C.,Wang Z.K.

Publisher

Elsevier

Link

http://woodhead.metapress.com/index/U385777748503803.pdf

Reference100 articles.

1. Laser Machining of Silicon using Diode-Pumped Solid State & CO2 Lasers;Corboline,2002

2. Wafer Sawing Process Characterization for Thin Die (75 micron) Applications;Paydenkar,2004

3. Laser technology for wafer dicing and microvia drilling for next generation wafers;Toftness;Proceedings of SPIE,2005

4. Laser Dicing of Silicon and Composite Semiconductor Materials;Sibailly;Proceedings of SPIE,2004

5. Laser ablation of silicon wafer with a water microdrop;Shimizu;J. of Laser Applications,2006

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Metal Material Processing Using Femtosecond Lasers: Theories, Principles, and Applications;Materials;2024-07-09

2. Laser Assisted Cleaving for Waveguide Facets on Silicon;2022 Intermountain Engineering, Technology and Computing (IETC);2022-05

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