Multilayer low-temperature co-fired ceramic systems incorporating a thick-film printing process
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Publisher
Elsevier
Link
http://woodhead.metapress.com/index/L0366560875J34G7.pdf
Reference112 articles.
1. Aspects of micro structuring low temperature co-fired ceramic (LTCC) for realization of complex 3D objects by embossing;Andrijasevic;Microelectronic Engineering,2007
2. Fabrication of precise fluidic structures in LTCC;Barlow;International Journal of Applied Ceramic Technology,2009
3. Investigation of interactions between co-fired LTCC components;Birol;Journal of the European Ceramic Society,2005
4. Influence of processing and conduction materials on properties of co-fired resistors in LTCC structures;Birol;Journal of the European Ceramic Society,2006
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