Aspects of micro structuring low temperature co-fired ceramic (LTCC) for realisation complex 3D objects by embossing-Reference-Cited by-同舟云学术

Aspects of micro structuring low temperature co-fired ceramic (LTCC) for realisation complex 3D objects by embossing

Published:2007-05 Issue:5-8 Volume:84 Page:1198-1201
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Andrijasevic Daniela,Smetana Walter,Zehetner Johann,Zoppel Sandra,Brenner Werner

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference3 articles.

1. L. Rebenklau, Beitrage zm Aufbau und zur Technologie LTCC-basierter microfluidische Bauelemente und Systeme, PhD Thesis, TU Dresden, 2005.

2. Embossing of 3D ceramic microstructures

3. http://www.ceramtec.com.

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